Semiconductor manufacturing is a process that the electronic component are manufactured on silicon semiconductor, while the electronic components are made up of sophisticated integrated circuit, the process mainly includes manufacture of wafer, manufacture of IC with wafer (manufacture of thin film, photolithography, etching and ion implantation), metallization process, wire bonding, packaging and test. There are some materials used in the process of semiconductor manufacturing, semiconductor materials mainly include silicon, germanium and gallium arsenide. Photoresist used in the photolithography is a kind of photosensitive material which is mixed with photosensitizer, resin and solvent. Insulating material, aluminium and albronze are used in the metallization process, gold thread with diameter of 0.025mm is used in the process of wire bonding. Finally epoxy resin and ceram material are used in the process of packaging. Plasma etching of integrated circuits is a crucial process in semiconductor manufacturing. With the development of semiconductor industry technology and the refinement of component in integrated circuits, plasma etching technology has been widely used in semiconductor manufacturing process due to its advantages such as anisotropic etching, process compatibility and few etching residues. The etching gas manufactured by our company is usually fluoride gas, including nitrogen trifluoride, perfluorobutadiene, hexafluoroethane, octafluoropropane, etc.